Liquid-cooling thermal management for artificial intelligence (AI) and data centers introduced by Vertiv

Questions and answers:

• What are the Vertiv CoolChip CDU models for? They are designed for liquid cooling in high-performance computing (HPC) and artificial intelligence (AI) applications, including retrofit and greenfield data centers.
• What is the cooling capacity of the Vertiv CoolChip CDU 600, and what type of system is it? The Vertiv CoolChip CDU 600 provides 600 kilowatts of cooling, and is an in-row, liquid-to-liquid cooling system.
• How does the Vertiv CoolChip CDU 100 support high-density workloads? It offers 100 kilowatts of cooling in a 4U form factor with a large-surface heat exchanger, integrated controller, and built-in fluid filtration for thermal stability.

WESTERVILLE, Ohio – Vertiv Group Corp. in Westerville, Ohio, is introducing three versions of the Vertiv CoolChip Coolant Distribution Unit (CDU) for liquid cooling in high-performance computing (HPC) and artificial intelligence (AI) applications.

The the Vertiv CoolChip CDU 70, Vertiv CoolChip CDU 100, and Vertiv CoolChip CDU 600 are direct-to-chip (DTC) liquid thermal management systems.

These models are for retrofit or greenfield data center environments, with models including in-rack and row-based configurations, and liquid-to-air and liquid-to-liquid technologies. The Vertiv CoolChip CDU family is for applications ranging from retrofitting existing facilities to scaling high-density AI and HPC clusters in new builds.

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Tell me more about electronics liquid cooling

• Electronics liquid cooling uses liquids -- typically water or specialized coolants -- to absorb and transfer heat away from high-power electronic components. Unlike traditional air cooling, liquid cooling is more efficient at handling dense heat loads in applications like high-performance computing (HPC), data centers, and military electronics. Key methods include direct-to-chip (DTC) cooling, cold plates, and immersion cooling.

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The CoolChip CDU 70 is an in-row, liquid-to-air coolant distribution unit for liquid cooling in data centers that must use existing thermal infrastructure. The system delivers as much as 70 kilowatts of cooling capacity.

Its integrated controller supports real-time monitoring, group control and unit-to-unit communication, for coordinated thermal performance, simplified management, and efficient scaling across several different racks.

Vertiv CoolChip CDU 100 offers liquid-to-liquid in-rack cooling for high-density workloads. If offers 100 kilowatts of cooling capacity in a 4U form factor and a large-surface heat exchanger engineered for low approach temperatures. An integrated controller provides monitoring and control, and built-in filtration help maintain fluid quality and thermal stability.

Liquid-to-liquid cooling

The Vertiv CoolChip CDU 600 is an in-row liquid-to-liquid model for AI and HPC deployments. The 600-kilowatt system is for hyperscale and colocation environments, supports in-row configurations, and integrates into raised-floor or retrofit installations.

It offers a top- or bottom-piping connection and available internal manifolds, streamlines infrastructure planning, and speeds installation with redundant pumps, and advanced monitoring for temperature and fluid quality.

For more information contact Vertiv online at www.vertiv.com.